⚡
"We need results fast, not lengthy R&D cycles"
Pilot projects deliver digital twins in 30-60 days. You see ROI before committing to a full partnership.
→ Proof of value in weeks, not years
Inline Holographic Inspection for Translucent Industrial Components
Inline QA for Optics, Wafers & PCBs
Start with inline holographic inspection of transparent/translucent components. Detect defects in production—no stopping the line. Then expand to semiconductors and medical applications.
Upload Holography Data Now
*15 minute average processing time, just send: Sensor data, Emitter Wavelength, object + emitter distance, and beam splitter position (if applicable, and we complete the process).
One-Time Calibration:Upload an image of your kit's calibration object (Miniature Polygonal Bear for M3/M4, Salt Slide for M5). We generate a Software-Defined Calibration profile that corrects your hardware's optical imperfections forever.
Upload & Process:Send raw sensor data (single monochrome or RGB+white light set) with parameters: wavelength (nm), subject-to-sensor distance (mm), pixel width (µm), emitter distance (mm). We return a pristine 3D model in ~15 minutes.
Reality,
Unlocked.
Hardware-agnostic, display-independent, and capable of converting real-life objects to 3D models.
Fast 3D reconstruction vs $50K microscope. We convert holography data into 3D models. API-driven method converts data into viewable 3D with SDC. No lenses - Just capture in-line or with a beam-splitter, and let us handle the rest.
Linear Pilot Roadmap: Industrial QA First, Medical Later
We start with low-risk industrial translucent component inspection (optics, wafers, slides), then expand to semiconductors, and finally medical applications. Each step builds on proven technology and customer success.
🎯 STEP 1: Inline Industrial QA (M3/M3A) — PRIMARY PILOT
The Problem:2D cameras can't detect critical 3D defects like BGA "head-in-pillow" failures, solder paste volume errors, or microvia depth issues—leading to costly field failures.
The Solution:
- •3D Solder Paste Inspection (SPI):Measure volume, area, and height of every deposit before component placement
- •BGA Standoff Measurement:Detect collapsed solder balls at micron precision
- •Microvia Depth Check:Non-contact measurement of laser-drilled holes before plating
→ M3A for Optics (iris aperture) handles low-contrast transparent flux; M3 for high-speed automated inspection
⚡ STEP 2: Semiconductor Expansion (M4 Off-Axis)
The Problem:Wafer defects (pits, scratches, etch depth errors) are invisible to 2D inspection but catastrophic to yield. Current solutions require slow, expensive SEM or AFM.
The Solution:
- •Wafer Defect Detection:Scan bare silicon for pits, scratches, contaminants at nanometer scale
- •Etch Depth Metrology:Measure trench depth, feature height, sidewall angles for process control
- •MEMS Device Analysis:Real-time 3D profiling of cantilevers, membranes, micro-gears
→ Off-axis M4 eliminates twin-image artifacts; 5-10mm object distance captures high-angle diffracted light from micron features
🔭 STEP 2: Precision Optics QA (M4 Off-Axis)
The Problem:Surface quality determines optical performance. Contact profilometry risks damage; interferometry is expensive and slow.
The Solution:
- •Surface Roughness (Ra) Measurement:Non-contact nanometer-scale topography of mirrors, lenses, optical flats
- •Micro-Lens Array (MLA) QA:Measure radius of curvature, uniformity, height of hundreds of lenslets in one shot
- •Scratch/Dig Quantification:Precise depth/width measurement for MIL-SPEC or ISO compliance
→ Full-color RGB holography reveals coating defects invisible to monochrome systems
🧬 STEP 3: Medical & Life Sciences (M5) — FUTURE EXPANSION
Future Application: Once inline industrial QA is proven, the same holographic technology enables label-free live cell imaging.Traditional microscopy requires killing cells with toxic stains. You can't observe living cells responding to drugs over time.
The Solution:
- •Label-Free Live Cell Imaging (QPI):Measure phase shifts to map cell biomass and internal structure without staining
- •Drug Response Studies:Watch living cells react to stimuli over hours/days
- •Medical Implant Surface QA:3D roughness maps of hip/dental implants for biointegration specs
→ M5 pinhole-based inline microscope: 10mm source-to-sample, 130mm sample-to-sensor for wide-field label-free imaging
Why Forward-Thinking Organizations Choose Aperture API
We understand your concerns. Here's how we address them head-on.
🔒
"Our data is sensitive—can we trust cloud processing?"
Enterprise clients keep data secure on-prem.
→ Security & compliance built-in
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"What if this doesn't work with our workflow?"
Integrates with existing QA systems.
→ Integrate, don't replace
Break Free from Proprietary Lock-In
Old model: vendor lock-in. Upgrade one component? Replace the entire stack.
❌ The Old Way
Expensive Proprietary Bundles
- • Locked to one vendor's ecosystem
- • Can't upgrade components independently
- • Forced obsolescence every 3-5 years
- • Limited to their display partners
✓ The Aperture API Way
Hardware-Agnostic Freedom
- • Use any microscope or sensor array
- • Display on any holographic device
- • Upgrade hardware without changing software
- • Future-proof your investment
💡 Your Advantage
Maximum Flexibility
- • Protect existing hardware investments
- • Scale across multiple facilities
- • Choose best-in-class components
- • Own your data and workflow
Real Example:A semiconductor inspection team saved $340K by keeping their existing microscopes and only adding our software layer—instead of replacing their entire quality control infrastructure.
See How This Works for Your TeamPrismView: The Modular Hardware Ecosystem
We provide blueprints; you build your tool.
What We Ship: Core Electronics Kit
- Emitter Module:Tri-Color (RGB) Laser (638/520/450nm, 5mW each) OR high-power RGB LED for low-speckle apps
- CMOS Sensor:High-res monochrome sensor, pre-soldered with 24-pin FFC connector
- Optics Module:50/50 plate beamsplitter (for M4/M7 off-axis systems)
- Aperture Module:Precision iris diaphragm (for M3A contrast control)
- Calibration Items:Miniature/Large Polygonal Bear, Salt Slide
Cost: ~$1,200-$1,800 depending on configuration
What You Provide
- 3D Printer:Download our STL/STEP files and print your chassis (PETG-CF or PLA recommended)
- Basic Assembly:Mount electronics in printed chassis (no soldering; plug-and-play FFC connectors)
- Optional:Purchase pre-manufactured enclosures from OEM partners listed on our site
Total ~$1,500-$2,500 vs $50K traditional
Hot-Swappable Modularity: The Killer Feature
The emitter and sensor modules arephysically interchangeablebetween M3, M3A, M4, and M5 chassis. Use one kit, swap electronics for projects.
Monday: Cell Biology (M5)
Install your sensor and fiber-coupled laser in the M5 microscope chassis. Capture label-free live cell holograms at 130mm working distance.
Wednesday: Semiconductor QA (M4)
Move the same electronics into your M4 off-axis chassis. Inspect MEMS devices at 5mm object distance with twin-image-free reconstruction.
Note: M7 uses a dedicated ultra-large sensor (Fujifilm GFX 100S II, 43.8×32.9mm) and is not hot-swappable with other models.
Inline Systems (M3, M3A, M5)
Simplest optical path: Emitter → Object → Sensor in a straight line.
- •M3:150mm emitter-to-object, 10-15mm object-to-sensor
- •M3A:Adds iris for 5-10mm closer object placement
- •M5:10mm pinhole-to-sample, 130mm sample-to-sensor (wide-field microscopy)
Off-Axis Systems (M4, M7)
Beamsplitter creates separate reference beam path; eliminates twin-image artifact.
- •M4:Compact (200×150mm), 15-25° ref beam, 5-10mm object distance
- •M7:Large-format (600×400mm), 10-15° ref beam, 100mm object distance, 60×45mm max area
Why Distance Matters
Object-to-sensor distance controls resolution and field-of-view trade-off.
- •Close (5-15mm):High NA → micron-scale resolution, small FOV
- •Far (100-130mm):Lower NA → larger FOV, coarser resolution
- • Software-Defined Calibration corrects for these geometric variations automatically
Cloud Processing & Content Creation Software
Turns raw data into valuable business assets.
Cloud Reconstruction
GPU processing with noise/artifact suppression.
Digital Twin Sync
Align digital twin with real data; share for collaboration.
Secure & API-Driven
Manage files and integrate via APIs.
Plans & Pricing
ROI plans from pilot to enterprise.
Industrial QA Pilot
$5,000 - $15,000
- ✓ Focus: Optics, wafers, PCBs, translucent components
- ✓ 30-60 day proof-of-concept
- ✓ Process 50-100 sample images from your hardware
- ✓ Deliver calibration profile + 3D reconstructions
- ✓ ROI analysis: defect detection rate, time savings
- ✓ Integration path for your existing QA systems
Works with existing sensors or PrismView kits
Integration Partnership
$25,000 - $100,000 / year
- ✓ Unlimited image processing (volume-based tiers)
- ✓ REST API access for automated QA workflows
- ✓ Custom reconstruction parameter optimization
- ✓ Multi-wavelength (RGB) and off-axis support
- ✓ 99.9% SLA with priority processing queue
- ✓ Quarterly optimization reviews with Stanford-trained holography engineers
Scales from labs to multi-site operations
Enterprise Alliance
Custom Pricing
- ✓ Custom feature development
- ✓ On-prem or private cloud options
- ✓ Dedicated engineering support
- ✓ Quarterly optimization sessions
Ready to build your first Digital Twin?
Tell us your use case; we'll scope a pilot.